Key Specifications/Special Features:
20 layer,
HDI with 1+N+1 structure,
FR408HR material，
2.40mm thick,
H OZ base copper on all layers,
ENIG surface finish，
Matte green solder mask,
With hard gold finger at the edge-board,
With impedance control,
Copper fill by VCP process,
With plasma process,
Min w/s(line width/spacing) 3.8/34.0 mil,
Min BGA pad 0.25mm,
Min mechanical drill bit 0.20mm,
With Laser via holes from layer1 to layer 2, from layer 11 to layer 12,
Other blind holes from L1 to L8 and from L20 to L13.
