Key Specifications/Special Features:
Application Field: Communication server
24-layer
FR4 (Tg170) material
Layer NO. : 24 Layer
Board Thickness:5.6mm
Trace Width/Space: 4/4 mil
Surface Treatment: ENIG
Matte green solder mask
Min w/s (line width/spacing) 4.0/4.7mil
Min hole 0.20mm
Min BGA pad size: 0.30mm
