HDI with 1+N+1 structure, without buried holes
FR4 (Tg170) material
1.60mm thick,
1 OZ finished copper on inner layers
ENIG surface finish
Matte green solder mask
Min w/s (line width/spacing) 5.0/5.0 mil
@ 2016 Kingshine Electronic Corporations All rights reserved. Guangdong ICP09646990 No.
