Special Features:
12 layers,
1.60mm thick,
FR4(170) material,
Immersion gold,
Green solder mask,
H OZ base copper on signal layers,
1OZ on GND and PWR layers,
With impedance control,
Min drill bit 0.20mm,
Min. line width/space: 4.0/4.7mil,
BGA pad size: 0.40mm.
