10 layers,
1.73mm thick,
FR4(180) material,
immersion gold,
green solder mask,
1 OZ finished copper on all layers,
min drill bit 0.225mm,
min. line width/space: 3.8/4.0mil,
BGA pad size: 0.25mm,
with impedance control
@ 2016 Kingshine Electronic Corporations All rights reserved. Guangdong ICP09646990 No.
