Special Features:
16-layer, FR4(Tg170) material, 1.6mm thick, 1OZ copper on all layers
ENIG surface finish, hard gold finger, edge bevel, matte green solder mask, with impedance control, 3.0/4.0mil min w/s(line width/spacing), min PTH hole 0.20mm
Laser via holes(about lay-up structure, please see the picture)
